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Master Bond adhesives
Lead-Free Bismuth Alloy, Copper Alloy, UNS C49300, H04 Temper, Bar
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: Hard

Excellent Suitability - Soldering, Capacity for Being Hot Formed; Good Suitability – Brazing; Fair Suitability – Butt Weld; Poor Suitability – Capacity for Being Cold Worked

Typical Uses: Cu Alloy based devices for lead-free water applications; Lead-free defined by Calif. AB 1953, max .25% Pb content; Lead-free, dezincification resistant alloy for potable water components; Valves, fittings, pumps, meters

Applicable Specifications: Forgings, Die (Hot Pressed) – ASME SB283, ASTM B283/B283M; Rod, Bar & Shapes – Forgings ASTM B124/B124M; Rod, Bar & Wire – ASTM B967/B967M

Vendors:
Available Properties
  • Density
  • Hardness, Vickers
  • Tensile Strength, Yield, 0.2% Offset
  • Elongation at Break
  • Tensile Modulus
  • Modulus of Rigidity
  • Compressive Yield Strength
  • Poissons Ratio, Calculated
  • Fatigue Strength
  • Machinability
  • Forgeability
  • Shear Strength
  • Electrical Resistivity, 15.4% IACS
  • Magnetic Permeability
  • CTE, linear
  • CTE, linear
  • CTE, linear
  • Specific Heat Capacity
  • Thermal Conductivity
  • Melting Point
  • Solidus
  • Liquidus
  • Antimony, Sb
  • Bismuth, Bi
  • Cadmium, Cd
  • Copper, Cu
  • Iron, Fe
  • Lead, Pb
  • Nickel, Ni
  • Selenium, Se
  • Silicon, Si
  • Tin, Sn
  • Zinc, Zn, As Balance
  
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