| Gelease™ MG-100 is a one-component thermally conductive silicone gel interface material that exhibits the low thermal resistance properties of a grease while possessing the integrity of a gel. The Gelease™ formulation is designed to provide the most efficient heat transfer from Flip Chip microprocessors, PPGAs, BGAs, microBGAs, DSP chips, graphic accelerator chips, and other high wattage electronic components. The crosslinked structure of Gelease™ MG-100 inhibits bleed, separation, and pump-out that are typically observed in many thermal interface materials.All information provided by Lord. |
