Key Features:- Very low viscosity
- High electrical insulation
- Superior heat resistance
- Excellent optical clarity
Master Bond EP112 is a low viscosity two component epoxy resin system for potting, encapsulation, sealing, coating and impregnation. The mix ratio is an easy to use 100:80 by weight. EP112 offers a long open time of 2-3 days or more. It does require oven curing for a number of hours. A typical cure schedule would be 1-2 hours at 200-210°F followed by 3-4 hours at 250°F and then 4-6 hours at 300°F. Post curing at 350°F enhances product properties. Some of the more salient attributes of EP112 are outstanding electrical insulation properties, solid physical strength values as well as noteworthy optical clarity. It has excellent adhesion to glass fibers and ceramics, along with metals, composites, glass and many rubbers and plastics. EP112 is serviceable over the wide temperature range of -60°F to +450°F. It features good resistance to a variety of chemicals, including water, oils, fuels, acids and bases. Master Bond EP112 is widely used for potting, sealing, casting and encapsulation applications, as well as impregnations. It is especially useful as it pertains to epoxy, composite and other fiber reinforced structures found in pipes, storage tanks, instrumentation and computers, among other electronic and aerospace structures. Since it retains its wonderful electrical insulation profile, even in harsh conditions, EP112 can be used in numerous electrical applications, including those with transformers and their bushings, switchgear components, resistors and many other electrical devices. Even though the cure schedule is somewhat long, the advantages in using EP112 in terms of its cured properties and ease of application enables it to be used in a wide variety of applications. Product Advantages: - Low viscosity, very long working life at ambient temperatures; very low exotherm
- Superb physical strength properties. Solid dimensional stability
- Impressive electrical insulation characteristics
- Outstanding adhesion to similar and dissimilar substrates
- Thermal stability, service temperature range -60°F to +450°F
- Ideal for impregnation applications
Information provided by Master Bond Inc. |
