Epoxy Potting and Encapsulating Systems for Electronic Applications High technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.
Cytec (Conap) FR-1046 / EA-117 Conapoxy® Resin / Conacure® Hardener High heat distortion, filled, non-abrasive, low shrinkage, low exotherm system with excellent thermal shock resistance.
- Mix Ratio, Resin/Hardener (by weight): 100/10
Cure Type: Elevated Temperature Information provided by Cytec, subsequently acquired by Elantas. |