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Master Bond adhesives
Parker Chomerics THERMATTACH® T404 Thermally Conductive Attachment Tape
Categories: Polymer; Tape

Material Notes: Description: THERMATTACH® double-sided thermal interface tapes provide exceptional bonding properties between electronic components and heat sinks, eliminating and need for mechanical fasteners. THERMATTACH® tapes are proven to offer excellent reliability when exposed to thermal, mechanical, and environmental conditioning.

Features/Benefits: Offered in various forms to provide thermal, dielectric, and flame retardant properties; Offered in custom die-cut configurations to suit a variety of applications; Eliminate the need for mechanical attachment (i.e. screws, clips, rivets, fasteners); Proven reliability under various mechanical, thermal, and environmental stresses; Embossed version available; Meets RoHS specifications; No curing required, unlike epoxy or acrylic performs or liquid systems and Easily reworkable

Typical Applications: Mount heat sinks to components dissipating < -25 W; Attach heat sinks to PC (esp. graphics) processors; Heat sink attachment to motor control processors and Telecommunication infrastructure components.

Product Attributes: Excellent dielectric strength due to polyimide carrier; Good thermal performance and Without halogenated flame retardant

Information provided by Chomerics

Available Properties
  • Thickness, ASTM D374
  • Outgassing - Total Mass Loss, ASTM E595, TML
  • Collected Volatile Condensable Material, ASTM E595
  • Adhesive Bond Strength, Chomerics #54, 400 psi attachment; 2 hour sample dwell time 25°C
  • Adhesive Bond Strength, ASTM D1002, Lap AL-Al
  • Peel Strength, ASTM D1000, 90°; to 0.002" aluminum foil
  • Volume Resistivity, ASTM D257
  • Dielectric Breakdown
  • CTE, linear, ASTM D3386, Adhesive
  • Thermal Conductivity, ASTM D5470
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Glass Transition Temp, Tg, ASTM D1356
  • Flammability, UL94
  • Shelf Life, Chomerics, From date of manufacture
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