Cookson Group Plaskon® SMT-B-2HS Molding Compound for Heat Spreader Applications

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Cookson Group Plaskon® SMT-B-2HS Molding Compound for Heat Spreader Applications (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy molding compound for high temperature, lead-free reflow. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, multifunctional resin designed to pass JEDEC Level 3 at 220°C IR reflow temperatures. Features: Lower moisture pickup Excellent moldability High glass transition temperature Fast cure Information provided by Cookson Electronics
Vendors:

Available Properties

Specific Gravity
Moisture Absorption at Equilibrium, at 85°C/85% RH, 168 hours
Viscosity, Shimadzu Viscosity, 1000 psi
Spiral Flow, at 175°C and 1000 psi
Ash
Storage Temperature, Recommended
Hardness, Shore D, Cull hot
Flexural Strength
Flexural Strength
Flexural Modulus
Flexural Modulus
Volume Resistivity
Volume Resistivity
Dielectric Constant
Dielectric Strength
CTE, linear, Alpha 1
CTE, linear, Alpha 2
Thermal Conductivity
Glass Transition Temp, Tg
Flammability, UL94
Mold Temperature
Back Pressure
Cure Time, In mold
Cure Time, Post mold
Gel Time, Ram follower, at 175°C and 1000 psi
Shelf Life, at 35°C, <40% loss of spiral flow
Shelf Life, at 22°C, <40% loss of spiral flow
Shelf Life, at 5°C, <40% loss of spiral flow

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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