| Product Description: Master Bond Polymer Adhesive EP21AOLV-2LO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, coating and encapsulant. This versatile system will adhere to a wide variety of substrates including metals, glass, ceramics and many plastics. EP21AOLV-2LO has a convenient, one to one mix ratio by weight. Its ability to flow readily and smoothly is another benefit. It is also an excellent adhesive and coating, but realistically, the system is mostly used for potting and encapsulating. In fact, it can be used in larger potting applications because it has very low exotherm when curing. EP21AOLV-2LO resists a wide range of chemicals including water, oils, fuels and many solvents. The service temperature range for this epoxy is -60°F to +250°F. EP21AOLV-2LO has a low coefficient of thermal expansion and enhanced dimensional stability, along with both a high modulus and compressive strength. Its most significant feature is that it meets ASTM E595 requirements for NASA low outgassing. This combination of properties makes EP21AOLV-2LO highly desirable for a wide variety of applications. The color of Part A is gray; the color of Part B is off-white. EP21AOLV-2LO is widely used in the aerospace, electronic, electro-optical and optical industries where low outgassing, superior thermal conductivity and electrical insulation are critical requirements. Product Advantages: - Convenient mixing: non-critical equal weight ratio.
- Easy application: readily flowable when potting; brushable when bonding.
- Versatile cure schedules: ambient temperature cures or fast elevated temperature cures.
- High bonding strength to a wide variety of substrates.
- Low coefficient of expansion, low shrinkage and superb dimensional stability.
- Superior durability, thermal shock and chemical resistance.
- Outstanding thermal conductivity, over 10 BTU•in/ft2 •hr•°F.
- Excellent electrical insulation properties.
- Very low exotherm; suitable for larger castings.
Information provided by MasterBond® |
