MP 5404-FS is a one component, heat curable thixotropic paste epoxy adhesive. It is a non-sag adhesive, which forms strong bonds to metals and ceramics. MP 5404-FS has exceptional thermal stability and resistance to water, humidity and solvents. This product offers high heat resistance and cures in less than 20 seconds via induction or infrared heating.Information provided by Adhesive Systems, Inc. |