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Arlon Electronic Materials 47N Quick Cure Epoxy Low-Flow Prepreg
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes: 47N is a low-flow epoxy prepreg engineered for binding multilayer epoxy rigid-flex or attaching heat sinks to multilayer PCBs. An optional low lamination temperature protects components already mounted on the PCB.

  • Tetrafunctional modified epoxy resin system with a Tg of 130°C.
  • Optimized bond to aluminum and copper heat sinks - typical lap shear 1000 psi
  • Cure temperature as low as 150°C
  • Engineered with discrete flow ranges and fiberglass styles for optimal process flexibility
  • Electrical and mechanical properties meeting the requirements of IPC-4101/21, modified to be "Low-Flow"
  • RoHS/WEEE compliant
  • Cost competitive for high volume commercial applications

Typical Applications:

  • Bonding multilayer epoxy rigid-flex
  • Attaching heat sinks to multilayer PCBs
  • Dielectric insulators

Information provided by ARLON Electronic Materials.

Available Properties
  • Density, ASTM D792 Method A
  • Water Absorption, IPC TM-650
  • Modulus of Elasticity, IPC TM-650
  • Poissons Ratio, ASTM D3039
  • Peel Strength, IPC TM-650 2.4.8, After Thermal Stress
  • Volume Resistivity, IPC TM-650, C96/35/90
  • Volume Resistivity, IPC TM-650, E24/125
  • Surface Resistance, IPC TM-650, E24/125
  • Surface Resistance, IPC TM-650, C96/35/90
  • Dielectric Constant, IPC TM-650
  • Dielectric Strength, IPC TM-650
  • Dissipation Factor, IPC TM-650
  • CTE, linear, IPC TM-650 2.4.41
  • CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z direction
  • Thermal Conductivity, ASTM E1461
  • Glass Transition Temp, Tg, IPC TM-650 2.4.25, DSC
  • Decomposition Temperature, IPC TM-650 2.3.41, Onset
  • Decomposition Temperature, IPC TM-650 2.3.41, 5 percent
  • Flammability, UL94
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Rulon Bearings
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