Arlon Electronic Materials 47N Quick Cure Epoxy Low-Flow Prepreg

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Arlon Electronic Materials 47N Quick Cure Epoxy Low-Flow Prepreg
Categories:	Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive
Material Notes:	47N is a low-flow epoxy prepreg engineered for binding multilayer epoxy rigid-flex or attaching heat sinks to multilayer PCBs. An optional low lamination temperature protects components already mounted on the PCB. Tetrafunctional modified epoxy resin system with a Tg of 130°C. Optimized bond to aluminum and copper heat sinks - typical lap shear 1000 psi Cure temperature as low as 150°C Engineered with discrete flow ranges and fiberglass styles for optimal process flexibility Electrical and mechanical properties meeting the requirements of IPC-4101/21, modified to be "Low-Flow" RoHS/WEEE compliant Cost competitive for high volume commercial applications Typical Applications: Bonding multilayer epoxy rigid-flex Attaching heat sinks to multilayer PCBs Dielectric insulators \| Information provided by ARLON Electronic Materials.
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Available Properties

Density, ASTM D792 Method A
Water Absorption, IPC TM-650 2.6.2.1
Modulus of Elasticity, IPC TM-650 2.4.18.3
Poissons Ratio, ASTM D3039
Peel Strength, IPC TM-650 2.4.8, After Thermal Stress
Volume Resistivity, IPC TM-650 2.5.17.1, C96/35/90
Volume Resistivity, IPC TM-650 2.5.17.1, E24/125
Surface Resistance, IPC TM-650 2.5.17.1, E24/125
Surface Resistance, IPC TM-650 2.5.17.1, C96/35/90
Dielectric Constant, IPC TM-650 2.5.5.3
Dielectric Strength, IPC TM-650 2.5.6.2
Dissipation Factor, IPC TM-650 2.5.5.3
CTE, linear, IPC TM-650 2.4.41
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z direction
Thermal Conductivity, ASTM E1461
Glass Transition Temp, Tg, IPC TM-650 2.4.25, DSC
Decomposition Temperature, IPC TM-650 2.3.41, Onset
Decomposition Temperature, IPC TM-650 2.3.41, 5 percent
Flammability, UL94

Property Data

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Category Notes
Plastic

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