| Available Properties |
|---|
- Density, ISO 1183, DAM
- Moisture Absorption, Sim. to ISO 62, DS; DAM
- Viscosity, ISO 11443, Melt
- Viscosity Number, ISO 307, 1157, 1628, formic acid 90%
- Linear Mold Shrinkage, Flow, ISO 294-4, 2577, DAM
- Linear Mold Shrinkage, Transverse, ISO 294-4, 2577, DAM
- Elongation at Break, ISO 527-1/-2, DS; DAM
- Elongation at Break, ISO 527-1/-2, DS; 50%RH
- Elongation at Break, ISO 527-1/-2, DS; 50%RH
- Elongation at Break, ISO 527-1/-2, DS; DAM
- Tensile Modulus, ISO 527-1/-2, DS, derived from BK314LM; 50%RH
- Tensile Modulus, ISO 527-1/-2, DS, derived from BK314LM; DAM
- Flexural Strength, ISO 178, DAM
- Flexural Modulus, ISO 178, DS, derived from BK314LM; 50%RH
- Flexural Modulus, ISO 178, DS, derived from BK314LM; DAM
- Poissons Ratio, DAM
- Poissons Ratio, 50%RH
- Charpy Impact Unnotched, ISO 179/1eU, 50%RH
- Charpy Impact Unnotched, ISO 179/1eU, DAM
- Charpy Impact Unnotched, ISO 179/1eU, DAM
- Charpy Impact Unnotched, ISO 179/1eU, 50%RH
- Charpy Impact, Notched, ISO 179/1eA, 50%RH
- Charpy Impact, Notched, ISO 179/1eA, DAM
- Charpy Impact, Notched, ISO 179/1eA, DAM
- Charpy Impact, Notched, ISO 179/1eA, 50%RH
- Volume Resistivity, IEC 62631-3-1, 50%RH
- Volume Resistivity, IEC 62631-3-1, DAM
- Surface Resistance, IEC 62631-3-2, 50%RH
- Dielectric Strength, IEC 60243-1, 50%RH
- Dielectric Strength, IEC 60243-1, DAM
- Comparative Tracking Index, IEC 60112, DAM
- CTE, linear, Parallel to Flow, ISO 11359-1/-2, DS; DAM
- CTE, linear, Parallel to Flow, ISO 11359-1/-2, DS; DAM
- CTE, linear, Parallel to Flow, ISO 11359-1/-2, DS; DAM
- CTE, linear, Transverse to Flow, ISO 11359-1/-2, DS; DAM
- CTE, linear, Transverse to Flow, ISO 11359-1/-2, DS; DAM
- CTE, linear, Transverse to Flow, ISO 11359-1/-2, DS; DAM
- Melting Point, ISO 11357-1/-3, 10°C/min; DAM
- Deflection Temperature at 1.8 MPa (264 psi), ISO 75-1/-2, DAM
- Flammability, UL94, IEC 60695-11-10, DS; DAM
- Flame Spread, ISO 3795 (FMVSS 302), DS
- Oxygen Index, ISO 4589-1/-2, DS; DAM
- Melt Temperature, up to 300°C if moisture is low and residence time is short
- Melt Temperature, Optimum
- Mold Temperature
- Mold Temperature, Optimum
- Ejection Temperature
- Drying Temperature
- Dry Time, Dehumidified Dryer
- Moisture Content
- Hold Pressure
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