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Amatrium Materials AI
Tra-Con Tra-Bond 2125 Rigid Syntactic Repair Adhesive
Categories: Polymer; Adhesive; Thermoset; Epoxy; Filled/Reinforced Thermoset

Material Notes: TRA-BOND 2125 is a medium viscosity, low density syntactic foam epoxy formulation developed for industrial, electronic and aerospace honeycomb, fillet, edge-fill, contour repair, bonding and casting applications where a light-weight, low shrinkage and low expansion material is required. This adhesive is color-coded for smooth, easy mixing and handling at room temperature, and it develops strong, highly reliable bonds to most surfaces including metals, building construction products, glass and glass fabrics and many plastics. TRA- BOND 2125 is a completely unicellular material composed of micron-sized glass spheres in a high performance epoxy binder, has a very uniform point-to-point structure and exhibits low shrinkage during cure, good dimensional stability, low density, high strength-to-weight ratio, high dielectric strength, and a low dielectric constant. The fully cured adhesive is a strong, light weight and durable electrical insulator which can be cut, drilled, sawed and shaped as needed with ordinary shop tools. In addition, TRA-BOND 2125 is resistant to water, weather, gases and vapors, salt and salt solutions, mild acids and alkalis, alcohol, jet fuels, gasoline and other petroleum products, and many other organic and inorganic compounds.

Information provided by Tra-Con Inc.

Available Properties
  • Specific Gravity, Mixed
  • Viscosity, After mixing
  • Hardness, Shore D
  • Compressive Strength
  • Izod Impact, Notched
  • Volume Resistivity
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • CTE, linear
  • Thermal Conductivity
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time, 4 hrs @ 25°C + 4 hrs @ 65°C
  • Cure Time
  • Pot Life
Property Data

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Manufacturer Notes:
Tra-Con, Inc.

Category Notes

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