| The Accuglass T-12B (κ =3.2) Spin-on Glass (SOG) Series is a family of methyl-siloxane polymers used for interconnect and overcoat passivation in the manufacture of integrated circuits. The AccuglassT-12B series is specially formulated to fill narrow (down to 0.1µm), high aspect ratio (up to 10) gaps without voids while planarizing multi-level metal devices that require a lower κ than SiO2. AccuglassT-12B contains 15wt% CH3 (methyl) groups bonded to Si atoms in the Si-O backbone. The specific formulation results in a stable dielectric constant, high crack resistance, excellent gap fill and planarization properties of the cured film. In addition, post-cure films exhibit low shrinkage and are silanol (SiOH) free. Thin films of AccuglassT-12B are applied using a commercial coater and cured in a vertical or horizontal furnace to thicknesses up to 9000Å (single coat) and 2.0µm (double coat). Benefits - Industry proven performance and broad acceptance
- T-12B fills gaps as small as 0.1µm
- High thermal stability. Compatible with hot aluminum and tungsten plug processing. Permeability allows for hydrogen annealing of gate oxides
- Thickness variation within a wafer of less than 1% over 8-inch wafers
- Lower dielectric constant compared to silicates, phosphorus silicates and most siloxanes
- Crack resistance up to 2.0µm
- Silanol free films post-cure
- Good adhesion to top and bottom dielectric layer
Applications:- ILD and Planarization
- Overcoat Passivation
- Gapfill
AccuglassT-12B is suitable for gap fill and planarization of ILD layers used in multilevel metal IC devices. Typically, partial etchback (PEB) is used for ILD processing. AccuglassT-12B can also be used to improve planarization of the final passivation layer.Information provided by Honeywell |
