Key Features:- Convenient handling and processing
- Resists temperatures up to +650°F
- Thermally conductive, electrically insulating
- Meets NASA low outgassing requirements
Master Bond EP17HTDM-2 Black is a one component, heat cured epoxy system that is used for bonding and sealing, as well as die attach applications. This flowable, high viscosity system, cures in 4-6 hours at 300°F or 2-3 hours at 350°F. Post curing at 400°F for 1-2 hours will optimize properties. EP17HTDM-2 Black has limited flow and low exotherm when curing, and it is compatible for die attach applications. This epoxy contains no solvents or diluents. EP17HTDM-2 Black bonds well to similar and dissimilar substrates such as metal, ceramics, plastics and composites. It is a superb electrical insulator with good thermal conductivity, even at elevated temperatures. The particle size of the thermally conductive filler is very small. This allows for exceptionally thin bond lines ranging from 5 to 15 microns. Having thinner bond lines translates to lower thermal resistance. The Tg is 190- 195°C. The compressive strength and tensile modulus are noted in the chart below. It is resistant to many chemicals including acids, bases, salts, fuels, oils and solvents. Its service temperature range is -80°F to +650°F. This epoxy uses EP17HTDM-2 Black should be considered for applications in aerospace, electronics, specialty OEM and related industries, where high temperature resistance, easy handling, and an array of physical strength properties are desirable. Product Advantages: - Single component system; no mixing prior to use
- High temperature resistance
- Very good electrical insulation properties, even at higher temperatures
- Ideal viscosity flow profile for die attaching
- Good thermal conductivity
- Excellent die shear strength
Information provided by Master Bond Inc. |
