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Elmet Technologies
Henkel Loctite® ABLESTIK ACP 3122 Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Golden Brown

Cure: Heat cure

Product Benefits:

  • Snap curable
  • Anisotropic electrically conductive
  • Low temperature cure
  • Optimized rheology
  • Electrically conductive in the z-axis only
Application: Assembly

Typical Assembly Applications: Copper circuitry, Gold plated terminators and Silver ink conductive traces

LOCTITE ABLESTIK ACP 3122 anisotropic, epoxy adhesive is designed for high throughput microelectronics assembly applications. This adhesive conducts only in one direction, making it suitable for small die and component attachment without the possibility of electrical shorting. LOCTITE ABLESTIK ACP 3122 requires pressure during cure to establish a reliable interconnect.

Information provided by Loctite®

Available Properties
  • Viscosity
  • Viscosity
  • Tensile Modulus, Storage Modulus, DMA, Ramp Rate 3ºC/minute
  • Tensile Modulus, Storage Modulus, DMA, Ramp Rate 3ºC/minute
  • Tensile Modulus, Storage Modulus, DMA, Ramp Rate 3ºC/minute
  • Glass Transition Temp, Tg, DMA, Tan ? Max
  • Cure Time, under optimum pressure, bondline temperature
  • Working Life
  • Shelf Life, Uncured
Property Data

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Manufacturer Notes:
Loctite Division of Henkel

Category Notes

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