Features: exhibits low shrinkage and stress on components as it cures. maintains low viscosity for complete and void-free encapsulation. suitable for curing at room temperature; may be mildly heat cured (60°C) to expedite cure. exhibits low exothermic heat rise during room temperature cure. Provides excellent thermal shock resistance. provides excellent flame retardancy; UL 94 V-0 certified. exhibits low gassing properties in high vacuum environments. can be used on parts and devices that experience operating temperatures from -55°C to +130°C.
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Category NotesPlastic