Appearance: blue Cure: Heat Cure Product Benefits: - Snap curable
- Compatible with small gap sizes
- Fast flow
Application: Underfill Substrates Ceramic, Organic, Solder mask and Polyimide Typical Application: Flip Chip LOCTITE ECCOBOND FP4530 underfill is designed for flip chip on flex applications with a 25micron gap. Upon cure, the material color will change from blue to green. Information provided by Loctite® |