| TRA-BOND 223F01 is recommended for high temperature bonding applications where high thermal conductivity, long working life, low shrinkage, excellent chemical resistance and low exotherm properties are required. This material is easily mixed and handled at room temperature, however an elevated cure schedule is REQUIRED to develop the full properties of the material. TRA-BOND 223F01 provides a low coefficient of thermal expansion and excellent adhesion to most metals, glass and plastic substrates. Fully cured TRA-BOND 223F01 is a mechanically strong and durable electrical insulator, it provides outstanding resistance to water, weathering, salts, mild acids and many other organic and inorganic materials. This material complies with the requirements of NASA`s Outgassing Specification when tested according to ASTM E-595-90. Information provided by Tra-Con Inc. |
