| BrewerBOND® 701 material is suitable for all production environments due to its high throughput and no-stress separation. The material was created for applications where higher temperature stability and lower total thickness variation (TTV) requirements are needed for downstream processing. BrewerBOND® 701 material is complementary to a wide variety of adhesive platforms and is an alternative technology to using mechanical debonding processes. BrewerBOND® 701 material is the most versatile excimer laser release material due to its ability to handle a variety of stress applications. Its typical thickness is 150-250 nm, and the material is thermally stable up to 350°C. The material is used with a transparent carrier and can be debonded at 308-nm or 355-nm laser wavelengths. BrewerBOND® 701 material can be removed with solvent prior to cure for rework. When using the laser debond process, this material is suitable for all production environments due to its high throughput and no-stress separation. Benefits: - Compatible with high-temperature backside processing = 400°C
- Enables no-stress separation from carrier at room temperature
- Enables alternative processes including selective debonding when used with other release layers
- Enables rapid debonding with excimer laser equipment
Market sectors include silicon interposer as bridge technology to initiate 3-D packaging; eWLB (FIWLP & FOWLP); Memory; and Compound semiconductor.Information provided by Brewer Science. |
