| Thermoset 985 epoxy adhesive is a two-component, solvent-free, thixotropic adhesive system used to temporarily bond the end surface of mono-crystalline (polycrystalline) silicon rods to the cutting boards. This adhesive system was designed specifically for the silicon ingot wire sawing process. Features: provides excellent adhesion to a wide variety of surfaces; primarily used for joining mono-crystalline (polycrystalline) silicon rods to cutting boards. can be easily removed from the silicon wafer surface under weak acidic conditions. develops high bond strength in 2-3 hours at room temperature. maintains hardness throughout wire sawing process, increasing wire sawing stability, reducing wire jumping and breaking rates, and effectively improving wafer yield rate. All information provided by Lord. |
