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Master Bond adhesives
Parker Chomerics THERMATTACH® T427 Thermally Conductive BGA Assembly Tape  (discontinued **)
Categories: Polymer; Adhesive

Material Notes: THERMATTACH have been designed to provide a high performance bond in the assembly of EBGA and TBGA semiconductor packages. Their thermally conductive filler ensures superior package performance when used to bond the flex or laminate substrate to stiffeners and heat spreaders.

Information provided by Chomerics

Vendors:
Available Properties
  • Specific Gravity, ASTM D792
  • Thickness, ASTM D374
  • Adhesive Bond Strength, Die Shear Adhesion (CTP No.54)
  • Peel Strength, ASTM D1000
  • Volume Resistivity, ASTM D257
  • Dielectric Breakdown, ASTM D149
  • Thermal Conductivity, ASTM D5470
  
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Manufacturer Notes:
none

Category Notes
Plastic

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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