| TRA-BOND 2151 is a thixotropic (smooth paste) heat conductive epoxy system that passes the NASA Outgassing Specification. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. This two-part adhesive develops strong, durable, high-impact bonds at room temperature which improve heat transfer while maintaining electrical insulation. TRA-BOND 2151 bonds readily to itself, and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its coeffcient of thermal expansion provides a good match for those materials over a fairly wide temperature range. Fully cured TRA-BOND 2151 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol. This adhesive complies with the requirements of NASA Outgassing Specification. Information provided by Tra-Con Inc. |
