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Metal adhesives
Henkel Loctite® ABLESTIK QMI2569 Silver Glass
Categories: Ceramic; Glass

Material Notes: Appearance: Silver paste

Cure: Firing

Product Benefits

  • Void-free bondline
  • Maximum thermal dissipation
Application: Semiconductor, Conductive Adhesive

Typical Package Application: Hermetic packages

LOCTITE ABLESTIK QMI2569 is a silver glass die attach adhesive used for attachment of integrated circuits in both solder seal glass seal hermetic packages. The material allows for simultaneous processing of die attach and leadframe embedding, while producing a void-free bondline for maximum thermal dissipation. Excellent RGA moisture results are acquired through the use of lead borate glass. The LOCTITE ABLESTIK QMI2569 also offers improved processability by allowing in-line drying during the firing process on die as large as 0.800" x 0.800". Either multi-needle or starfish can be used to apply the material. LOCTITE ABLESTIK QMI2569 can only be used in hermetic packaging applications.

Information provided by Loctite®

Available Properties
  • Filler Content, Silver
  • Viscosity, Uncured, Speed 10 rpm
  • Tensile Modulus, Cured, DMA
  • Peel Strength, Tensile Adhesion, 500 mil X 500 mil die at 25°C, Si die to Au plated ceramic
  • Volume Resistivity, Cured
  • CTE, linear, Cured, alpha1
  • Thermal Conductivity, Cured
  • Glass Transition Temp, Tg, Cured
  • Shelf Life, Uncured
Property Data

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Manufacturer Notes:
Loctite Division of Henkel

Category Notes

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Metal adhesives
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