| Description: Chomerics’ family of thin heat spreaders provides a low-cost, effective means of cooling IC devices in restricted spaces where conventional heat sinks are inappropriate. T-Wing spreaders consist of 5oz. [0.007inch/0.18mm thick] flexible copper foil between electrically insulating films. High strength silicone PSA (pressure-sensitive adhesive) provides a strong bond to the component. The compliant nature of these “thermal wing” heat spreaders permits nearly 100% adhesive contact with non-flat package surfaces, optimizing thermal and mechanical performance. Features/Benefits: Component junction temperature reduction of 10-20°C is common, Easily added to existing designs to lower component temperatures and improve reliability, Custom shapes available for complex designs, Low profile [0.33mm/0.013in] allows use in limited space environments, Easy peel and stick adhesion to all surfaces, including packages with residual silicone mold release, Offers low cost cooling for many package types, Low application force (<5psi/0.03MPa) minimizes risk of damage to component, Wide range of standard sizes, Pliable nature allows conformance to concave or otherwise non-flast surfaces for optimal thermal and mechanical performance, Light weight (0.039 oz/inch2), Standard parts are scored for easy forming and alignment, Easy removal for device replacement and Available die-cut on continuous rolls Typical Applications: Microprocessors, Memory modules, Laptop PC’s and other high density, hand held portable electronics, and High speed disk drives. RoHS compliant Information provided by Chomerics |
