MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  
Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.
Superior Flux Superior No. 435 Organic Acid, Non-Halide Tinning Flux
Categories: Metal; Nonferrous Metal; Solder/Braze Alloy

Material Notes:
  • Alcohol-based, non-halide, organic-acid flux.
  • Developed for electronic applications where halide type fluxes are not acceptable.
  • Specially formulated for Nickel alloys, Kovar, EN, and Copper and other lead metals.
  • Applications include components, IC's, and semiconductors, cerdips, and connectors.
  • Water-based, non-halide organic acid flux fitting IPC-ANSI-J-Std-004, Type ORM0.
Description: Superior No. 435 is a water-soluble flux that is entirely free of chlorides, bromides, and phosphates. It employs unique organic activators to strip off metal oxides and tarnish, without attacking the underlying metals. This flux has many of the excellent operational characteristics of halide-containing organic fluxes while being much less corrosive.

Applications: COMPONENT TINNING-Superior No. 435 is supplied in an alcohol-base to assist in reducing solder-balls, and provides most effective oxide removal as supplied. The flux may be used in dip, drag and other processes common to component tinning. After applying flux to leads, it is recommended that soldering be done shortly after flux application. To remove post-solder residues, a water temperature of 60ºC±10ºC/140ºF±20ºF is recommended for distilled or de-ionized water. A non-ionic surfactant may be added.

Information provided by Superior Flux

Vendors:
Available Properties
  • Specific Gravity
  • Density
  • pH
  • Flash Point, TCC Method
  • Processing Temperature, Soldering Range
  • Shelf Life
  
Property Data

This page displays only the text
of a material data sheet.

To see MatWeb's complete data
sheet for this material (including
material property data, metal
compositions, material suppliers,
etc
), please click the button below.

Manufacturer Notes:
none

Category Notes
none

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

 

solder replacement adhesives
Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at webmaster@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.