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Ensinger PEI
Arlon Electronic Materials 25N Low-Cost Ceramic Hydrocarbon
Categories: Polymer; Thermoset

Material Notes: High Frequency, Low Loss Thermoset Laminate and Prepreg for Double-sided, Multilayer and Mixed Dielectric Printed Circuit Boards

  • Low loss ceramic-filled thermoset resin
  • Tight dielectric tolerance control
  • Excellent dimensional stability
  • Excellent price/performance ratio


  • Greater signal integrity
  • Wider eye patterns
  • Excellent dimensional stability
  • Utilizes standard FR-4 processes
  • Excellent thermal properties

Typical Applications:

  • Cellular Base Station Antennas, Power Amplifiers, Down Converters
  • High Speed Backplanes

Information provided by ARLON Electronic Materials.

Available Properties
  • Density, ASTM D792 Method A
  • Water Absorption, IPC TM-650
  • Thickness, Prepreg thickness - glass style 1080
  • Thickness, Prepreg thickness - glass style 2112
  • Thickness, Prepreg thickness - glass style 2313
  • Outgassing - Total Mass Loss, ASTM E595-90, Water Vapor Recovered
  • Outgassing - Total Mass Loss, ASTM E595-90
  • Collected Volatile Condensable Material, ASTM E595-90
  • Tensile Strength, ASTM D882
  • Flexural Strength, ASTM D790
  • Peel Strength, IPC TM-650 2.4.8, After Thermal Stress
  • Volume Resistivity, IPC TM-650, Condition A
  • Surface Resistance, IPC TM-650, Condition A
  • Dielectric Constant, IPC TM-650, C23/50
  • Dissipation Factor, IPC TM-650, C23/50
  • CTE, linear, IPC TM-650 2.4.24, x, before Tg
  • CTE, linear, IPC TM-650 2.4.24, y, before Tg
  • CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z, before Tg
  • Thermal Conductivity, ASTM E1225
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