Premixed-frozen, snap-cure, thermally conductive, reworkable adhesive/encapsulant
DIS-A-PASTE 2310-PMF is a one component, pre-mixed frozen, mineral-filled, and off-white electrically insulating compliant polymer paste adhesive. It is designed to bond many dissimilar substrates and dissipate device generated heat. DIS-A-PASTE 2310-PMF is a 100% solid, solvent free system that will not form voids during cure or outgas after being cured. This product is a non-TDI based urethane system which has reversion resistance and physical stability when subjected to high heat and humidity environments. As a urethane, this system displays higher ionic purity than epoxy systems minimizing the chance of corrosion around sensitive components and circuitry.Production-oriented, snap-cure technology for surface mount applications-allows cure during solder reflow operation. High thixotropy/tack strength-holds components with minimal Z axis movement during cure. Stable viscosity for over 4 hours at RT-ideal for robotics. Reworkable for repair applications-save costly devices/PC boards. Low Tg (<-70°C) for excellent low temperature cycling and performance with minimal stress. Excellent substrate adhesion; superior to silicones: no primer required. Bonds DAT-A-THERM thermally conductive low modulus films to devices and substrates without loss of thermal conductivity. DIS-A-PASTE 2310-PMF also available with various thicknesses of internal bond-line spacers. Information provided by Aptek Laboratories, Inc. |
