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Arlon Electronic Materials 44N Multifunctional Microdispersed Ceramic Filled Epoxy-Fiberglass Prepreg
Categories: Polymer; Thermoset; Epoxy

Material Notes: Arlon 44N is a high resin content multifunctional (175°C) epoxy prepreg system with a proprietary microdispersed ceramic filler system. 44N is engineered for the filling of clearance holes in thin metal cores such as 0.006" Copper-invar-Copper or via holes in sequentially laminated MLB designs. Based on Arlon's 45N, the 44N system is compatible with conventional epoxy lamination fabrication.

  • Microdisperse ceramic filled to minimize resin shrinkage and cracking in filled clearance holes
  • Prepreg format eliminated the need for messy plate fill material in high volume applications
  • High Tg compatible with conventional multifunctional epoxy processing
  • Filled system has reduced Z-direction expansion and improved thermal conductivity for improved plated through hole reliability
  • Suitable for most lead-free applications
  • RoHS/WEEE compliant

Typical Applications:

  • Automotive Under-hood applications
  • Backplanes and Mother Boards
  • Ball Grid Array Packaging
  • High layer count MLBs

    Information provided by ARLON Electronic Materials.

  • Vendors:
    Available Properties
    • Density, ASTM D792 Method A
    • Water Absorption, IPC TM-650
    • Modulus of Elasticity, IPC TM-650
    • Poissons Ratio, ASTM D3039
    • Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Process Solutions
    • Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
    • Peel Strength, IPC TM-650, To Copper (1 oz./35 micron); At Elevated Temperatures
    • Volume Resistivity, IPC TM-650, C96/35/90
    • Volume Resistivity, IPC TM-650, E24/125
    • Surface Resistance, IPC TM-650, C96/35/90
    • Surface Resistance, IPC TM-650, E24/125
    • Dielectric Constant, IPC TM-650, may vary with resin %
    • Dielectric Strength, IPC TM-650
    • Dissipation Factor, IPC TM-650
    • Arc Resistance, IPC TM-650 2.5.1
    • CTE, linear, IPC TM-650 2.4.41
    • CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z, below Tg
    • CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z, above Tg
    • Thermal Conductivity, ASTM E1461
    • Glass Transition Temp, Tg, IPC TM-650 2.4.25, DSC
    • Flammability, UL94
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