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Master Bond adhesives
Henkel Loctite® ECCOBOND EO1016 Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Black

Cure: Heat Cure

Product Benefits:

  • Excellent shelf stability
  • Fast curing
  • flame-out
Application: Encapsulant

Typical Application: IC's, transistors and similar semiconductors

LOCTITE ECCOBOND EO1016 is an epoxy encapsulant intended for applications requiring excellent handling properties. The cured material survives severe thermal shock and offers continuous service to 177 °C. It is particularly suited for use on transistors and similar semiconductors, can be used for encapsulation of watch ICs.

Information provided by Loctite®

Available Properties
  • Specific Gravity
  • Moisture Absorption, 24 hours immersion
  • Moisture Absorption, 24 hours immersion
  • Brookfield Viscosity, Spindle 6, speed 20 rpm
  • Brookfield Viscosity, Spindle 6, speed 2 rpm
  • Hardness, Shore D, Cured
  • Tensile Strength, Cured
  • Elongation at Break, Cured
  • Flexural Strength, Cured
  • Flexural Modulus, Cured
  • Adhesive Bond Strength, Cohesive, Al-Al Tensile shear
  • Volume Resistivity, IEC 60093
  • Surface Resistance, IEC 60093
  • Dissipation Factor, IEC 60250
  • Arc Resistance, ASTM D495
  • CTE, linear, Cured, Below Tg
  • CTE, linear, Cured, Above Tg
  • Thermal Conductivity, Cured
  • Maximum Service Temperature, Air, DSC, Initial
  • Maximum Service Temperature, Air, DSC, Peak
  • Glass Transition Temp, Tg, Cured
  • Flammability, UL94
  • Shrinkage, 10 grams
  • Cure Time
  • Cure Time, Alternate Cure Schedule
  • Gel Time
  • Shelf Life
  • Shelf Life
Property Data

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Manufacturer Notes:
Loctite Division of Henkel

Category Notes

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