| LORD CoolTherm™ MD-140 SP silver-filled conductive adhesive offers excellent thermal conductivity. It is designed for use in thermally demanding die attach applications such as microprocessor, power semiconductor and VLSI assembly. CoolTherm MD-140 SP adhesive is low stress, making it suitable for use with large die. CoolTherm MD-140 SP adhesive provides excellent adhesion to a wide variety of surfaces including silicon, silver, gold and copper. Low ionic levels make it ideally suited for demanding semiconductor and hybrid assembly applications. Features: provides a working life of up to 72 hours after loading a syringe into the dispensing equipment at room temperature. allows high-speed, accurate syringe dispensing of fine dots or lines; can be used with time/pressure, positive displacement or linear dispense heads. rapidly cures at 150°C and 180°C. All information provided by Lord. |
