| AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive components to printed circuit boards. AA-BOND 2156 is two parts fast cure adhesive develops strong bond to many materials, and its coefficient of thermal expansion provides a good match for the application. Appearance: Tan Cure Type: Heat cure or Room Temperature Benefits: - Fast Cure
- Strong
- Durable
- High impact bonds at room temperature that improves heat
Mix Ratio by weight: 100:23/Resin:Hardener Substrates: Bonds readily to itself and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and to many other materials Typical Application: Fiber optic bundles, potting glass fibers and fiber optic connectors Information provided by Atom Adhesives |
