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Chemically Resistant adhesives
Atom Adhesives AA-BOND 2156 Epoxy Adhesive
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive; Epoxy, Thermally Conductive

Material Notes: AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive components to printed circuit boards. AA-BOND 2156 is two parts fast cure adhesive develops strong bond to many materials, and its coefficient of thermal expansion provides a good match for the application.

Appearance: Tan

Cure Type: Heat cure or Room Temperature


  • Fast Cure
  • Strong
  • Durable
  • High impact bonds at room temperature that improves heat
Mix Ratio by weight: 100:23/Resin:Hardener

Substrates: Bonds readily to itself and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and to many other materials

Typical Application: Fiber optic bundles, potting glass fibers and fiber optic connectors

Information provided by Atom Adhesives

Available Properties
  • Specific Gravity, uncured
  • Solids Content, reactive, uncured
  • Viscosity, Uncured, after Mixing
  • Hardness, Shore D
  • Shear Strength, Lap, Alum to Alum
  • Adhesive Bond Strength
  • CTE, linear
  • Thermal Conductivity
  • Minimum Service Temperature, Air
  • Glass Transition Temp, Tg
  • Cure Time
  • Cure Time
  • Cure Time
  • Pot Life, uncured
  • Shelf Life
Property Data

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Chemically Resistant adhesives
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