Henkel Loctite® ECCOBOND UF 8830S Epoxy

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Henkel Loctite® ECCOBOND UF 8830S Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Grey paste Cure: Heat cure Product Benefits: High purity High TG, low CTE Improved toughness Good flow with self filleting Long staging time and worklife 260ºC reflow capability for Pb-free, low-k applications Application: Underfill Typical Package Application: Flip Chip BGA LOCTITE ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow. When fully cured, this material forms a rigid, low stress seal that dissipates stress in solder joints and extends thermal cycling performance. Information provided by Loctite®
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Available Properties
Specific Gravity Brookfield Viscosity, Spindle 51, Speed 5 rpm Tensile Modulus, Storage, Cured, DMA CTE, linear, Cured, Below Tg CTE, linear, Cured, Above Tg Glass Transition Temp, Tg, Cured, by TMA Glass Transition Temp, Tg, Cured, by DMA Cure Time, ramp from 25°C to 150°C, hold 2hrs at 150°C Working Life, Worklife, 100% increase in viscosity Shelf Life

Property Data

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Manufacturer Notes:
Loctite Division of Henkel

Category Notes
Plastic

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