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Metal adhesives
Henkel Loctite® ABLESTIK ABP 8064T Adhesive
Categories: Polymer; Adhesive

Material Notes: Appearance: Silver

Cure: Heat Cure

Product Benefits:

  • High thermal conductivity
  • High electrical conductivity
  • Medium modulus
  • Low outgassing
  • Stable at high temperatures
  • Good reliability performance
  • Soft solder replacement
  • Use for wide range of package sizes
Application: Die attach

Typical Package Application: QFP, High power devices

LOCTITE ABLESTIK ABP 8064T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes.

Information provided by Loctite®

Available Properties
  • Brookfield Viscosity, Uncured, CP51, Speed 5 rpm
  • Tensile Modulus, Cured, DMTA
  • Tensile Modulus, Cured, DMTA
  • Volume Resistivity
  • CTE, linear, Cured, alpha1
  • CTE, linear, Cured, alpha2
  • Thermal Conductivity, Cured
  • Glass Transition Temp, Tg, Cured, by TMA
  • Cure Time, ramp from 25°C to 180°C, hold 60 mins at 180°C in N2 oven
  • Cure Time, ramp from 25°C to 140°C, hold 60 mins at 140°C in N2 oven, Alternative Cure Schedule
  • Working Life
  • Shelf Life, from date of manufacture
Property Data

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Manufacturer Notes:
Loctite Division of Henkel

Category Notes

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Metal adhesives
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