Key Features:- Low viscosity
- Ambient temperature cures
- 100% reactive
- Outstanding chemical resistance
- Bonds well to a wide range of substrates
- For bonding, sealing and encapsulation
Product Description: Master Bond EP41S-1 is a two component epoxy resin system for high performance bonding, sealing, coating and encapsulating. It has a 100 to 30 mix ratio by weight and is formulated to cure at ambient temperatures or more quickly at elevated temperatures. It has extraordinary resistance to a wide array of chemicals, including solvents, alcohols and fuels (a more detailed list of these chemicals appears below). Of special significance is its resistance to gasohol, which is fairly aggressive against many types of plastics and rubbers. EP41S-1 is 100% reactive and contains no solvents or diluents. It has very low linear shrinkage upon cure. Also, it has outstanding physical properties and electrical insulation values. EP41S-1 can be used as an adhesive, sealant, coating, potting or encapsulating material. It is serviceable over the wide temperature range of -60°F to +300°F. It adheres well to a wide variety of substrates including metals, glass, ceramics and many rubbers and plastics. The standard version of this system has a lower viscosity with good flow. A non-drip version called EP41S-1ND is also available. Part A is clear and Part B is amber clear. This epoxy compound is widely used in aerospace, electronic, chemical processing applications and in other applications where chemical resistance to solvents and fuels is needed. Product Advantages: - 100% reactive compound does not contain any solvents or diluents
- Versatile cure schedules; ambient temperature cures or fast elevated temperature cures
- High bonding strength to both similar and dissimilar Substrates
- Wide temperature service capability from -60°F to +300°F
- Good electrical insulator; low viscosity, ideal for potting and encapsulation
- Outstanding chemical resistance, particularly to fuels, alcohols and solvents
Information provided by Master Bond Inc. |
