| Available Properties |
|---|
- Density, ISO 1183
- Density, ISO 1183, Cond.
- Density, Melt
- Water Absorption, Sim. to ISO 62, Dry
- Moisture Absorption, Sim. to ISO 62, Dry
- Linear Mold Shrinkage, Flow, ISO 294-4, 2577, Dry
- Linear Mold Shrinkage, Flow
- Hardness, Shore D, ISO 7619-1, Dry
- Tensile Strength at Break, ISO 527-1/-2, Dry
- Tensile Strength, Yield, ISO 527-1/-2, Cond.
- Tensile Strength, Yield, ISO 527-1/-2, Dry
- Tensile Stress at Strain, ISO 527-1/-2, Dry
- Elongation at Break, ISO 527-1/-2, Dry
- Elongation at Break, ISO 527-1/-2, Cond.
- Elongation at Break, ISO 527-1/-2, Dry
- Elongation at Yield, ISO 527-1/-2, Dry
- Elongation at Yield, ISO 527-1/-2, Cond.
- Tensile Modulus, ISO 527-1/-2, Cond.
- Tensile Modulus, ISO 527-1/-2, Dry
- 100% Modulus, ISO 527-1/-2, Dry
- Charpy Impact Unnotched, ISO 179/1eU, Dry
- Charpy Impact Unnotched, ISO 179/1eU, Cond.
- Charpy Impact Unnotched, ISO 179/1eU, Dry
- Charpy Impact Unnotched, ISO 179/1eU, Cond.
- Charpy Impact, Notched, ISO 179/1eA, Cond.
- Charpy Impact, Notched, ISO 179/1eA, Dry
- Charpy Impact, Notched, ISO 179/1eA, Cond.
- Tear Strength, ISO 34-1, Dry
- Abrasion, ISO 4649, mm³; Dry
- Compression Set, ISO 815, Dry
- Volume Resistivity, IEC 60093, Dry
- Surface Resistance, IEC 60093, Cond.
- Dielectric Constant, IEC 60250, Dry
- Dielectric Constant, IEC 60250, Dry
- Dielectric Strength, IEC 60243-1, Dry
- Dissipation Factor, IEC 60250, Dry
- Dissipation Factor, IEC 60250, Dry
- Comparative Tracking Index, IEC 60112, Cond.
- CTE, linear, Parallel to Flow, ISO 11359-1/-2, Dry
- Specific Heat Capacity, Melt
- Thermal Conductivity, Melt
- Melting Point, ISO 11357-1/-3, 10°C/min; Dry
- Deflection Temperature at 0.46 MPa (66 psi), ISO 75-1/-2, Dry
- Vicat Softening Point, ISO 306, 50°C/h 50N; Dry
- Oxygen Index, ISO 4589-1/-2, Dry
- Melt Temperature, ISO 294, Injection Molding
- Mold Temperature, ISO 10724, Injection Molding
- Injection Velocity, ISO 294, Injection Molding
- Hold Pressure, ISO 294, Injection Molding
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