AA-BOND FS291 is a thixotropic room temperature cure epoxy adhesive system developed for structural bonding applications on vertical or overhead surfaces where its no-sag characteristics are critical. AA-BOND FS291 is medium exotherming system exhibits excellent flow and wetting characteristics. Cure Type: Heat cure or Room Temperature Benefits: - Excellent flow
- Excellent wetting characteristics
- Works on a wide variety of substrates
Mix Ratio by weight: 100:81/Resin:Hardener Substrates: Glass, most metals, and variety of plastics Typical Application: Structural bonding, overhead and vertical applications Information provided by Atom Adhesives |