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CRP Technology Windform® P2 Glass Fiber Reinforced Polyamide for HSS 3D Printing
Categories: Polymer; Rapid Prototyping Polymer; Thermoplastic; Nylon (Polyamide PA)

Material Notes: Windform® P2 is the second polymer from P-LINE. Compared to Windform® P1, which is the first material from P-LINE family, Windform® P2 is distinguished by increased stiffness (Tensile Modulus is 2925.20 MPa), combined to high tensile strength (39.24 MPa). As Windform® P2 is glass fiber filled, it is an insulating material (CTI rating of 600).

Applications include:

  • Components with detailed resolution
  • Small functional prototypes, end-use parts requiring high stiffness across a variety of sectors as electrical consumer and household goods, industrial products, automotive

Information provided by CRP Technology.

Key Words: High Speed Sintering (HSS)
Vendors:
Available Properties
  • Density
  • Hardness, Shore D, UNI EN ISO 868
  • Tensile Strength at Break, UNI EN ISO 527-1, Z Axis
  • Tensile Strength at Break, UNI EN ISO 527-1, Y Axis
  • Tensile Strength at Break, UNI EN ISO 527-1, X Axis
  • Elongation at Break, UNI EN ISO 527-1, Z Axis
  • Elongation at Break, UNI EN ISO 527-1, X Axis
  • Elongation at Break, UNI EN ISO 527-1, Y Axis
  • Tensile Modulus, UNI EN ISO 527-1, Y Axis
  • Tensile Modulus, UNI EN ISO 527-1, Z Axis
  • Tensile Modulus, UNI EN ISO 527-1, X Axis
  • Flexural Strength, UNI EN ISO 14125
  • Flexural Modulus, UNI EN ISO 14125
  • Charpy Impact Unnotched, UNI EN ISO 179-1
  • Charpy Impact Unnotched, UNI EN ISO 179-1
  • Charpy Impact, Notched, UNI EN ISO 179-1
  • Charpy Impact, Notched, UNI EN ISO 179-1
  • Volume Resistivity, ASTM D257-14
  • Surface Resistance, ASTM D257-14
  • Comparative Tracking Index, IEC 60112 Solution A
  • Melting Point, ISO 11357
  • Deflection Temperature at 1.8 MPa (264 psi), ISO 75 Method A
  • Vicat Softening Point, ISO 306 Method A50, 10 N
  
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Manufacturer Notes:
none

Category Notes
Plastic
PA, Polyamide

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