| A high viscosity Cyanoacrylate for large gap fill applications. Provides faster set times and improved gap filling capability compared to conventional Cyanoacrylates. The adhesive bonds to a wide range of substrates including metals, ceramics, plastics, and elastomers. It is excellent for bonding difficult to bond plastics such as acetal. Component in the Chem-Set™ CCA801 Chip Repair kit. Cure rates are dependent on the substrate, gap, and relative humidity. Chemical resistance: Cured resistance is reduced as polarity of the solvent increase. Non-polar solvents have minimal effect. Boiling water will destroy the bonds in less than 24 hours. Amines destroy the bonds rapidly. Information provided by Chemical Concepts™. |
