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Polymer Distribution
Microtherm Group Board Filament Reinforced Pyrogenic Silica Thermal Insulation
Categories: Ceramic; Oxide; Silicon Oxide; Other Engineering Material

Material Notes: Microtherm® Board is a high performance thermal insulation made at a lower density than normal Microtherm products. The insulation is an opacified blend of filament reinforced pyrogenic silica, specifically blended for toughness and optimized manipulation.
    Properties
  • Low density high temperature thermal insulation
  • Stable thermal performance for continuous exposure to 1000°C (1832°F)
  • Excellent machineability
  • Non combustible
  • Environmentally safe
  • Free of harmful respirable fibers
    Applications
  • Thermal batteries - rapid heat up
  • Space and Aerospace - lower weight
  • Portable fuel cells - easier to carry
  • Furnaces - easy installation

Information provided by Microtherm.

Vendors:
Available Properties
  • Density
  • Thickness
  • Compressive Strength, ASTM C165, Resistance at 10%, 230 kg/m³
  • Compressive Modulus, ASTM C165, @ 230 kg/m³
  • Specific Heat Capacity
  • Specific Heat Capacity
  • Specific Heat Capacity
  • Specific Heat Capacity
  • Specific Heat Capacity
  • Thermal Conductivity, ASTM C177, ISO 8302, @ 250 kg/m³
  • Thermal Conductivity, ASTM C177, ISO 8302, @ 250 kg/m³
  • Thermal Conductivity, ASTM C177, ISO 8302, @ 250 kg/m³
  • Thermal Conductivity, ASTM C177, ISO 8302, @ 250 kg/m³
  • Thermal Conductivity, ASTM C177, ISO 8302, @ 250 kg/m³
  • Thermal Conductivity, ASTM C177, ISO 8302, @ 250 kg/m³
  • Thermal Conductivity, ASTM C177, ISO 8302, @ 250 kg/m³
  • Maximum Service Temperature, Air, for long term exposure
  
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