| The patented* ACCUFLO T-27 Series is a family of organic polymers formulated in an environmental friendly solvent system designed to fill and planarize a wide spectrum of aggressive topographies. Commercially available since 1995, the ACCUFLO Series: ACCUFLO T-13EL, ACCUFLO T-25 and now ACCUFLO T-27 are currently being used in numerous manufacturing locations worldwide. The ACCUFLO T-27 Series offers excellent void-free fill capability and superior local, regional and global planarization of ultra deep sub-micron features with an aspect ratio exceeding 60:1. The performance advantages offered by ACCUFLO T-27 films include improved thermal stability, reduced viscosity and reduced inter-facial surface tension to enhance coating properties. Benefits - Reduced viscosity and surface tension to enhance coating
- Superior melt reflow for planarization and feature fill
- Room temperature storage
- Industry accepted safe solvent with high flash point
- Industry proven technology
- Ease of integration — uses known technology and current tool sets
- Excellent cost of ownership
Applications: Total Etch Back Planarization -Transfer local and regional planarity to the underlying film using ACCUFLO T-27 films as the sacrificial planarization film in a total etch back integration process.
Feature Fill and Masking-ACCUFLO T-27 films are applied as a sacrificial fill and planarizing material that is partially etched back exposing the underlying substrate films. Specific processing of the exposed films then occurs with the deeper features masked by ACCUFLO T-27. Upon completion, the remaining ACCUFLO T-27 film is removed using a conventional stripping process.Information provided by Honeywell |
