Ensinger TECASINT™ 2061 Polyimide, 15% Graphite, 10% PTFE Filled (PI)

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Ensinger TECASINT™ 2061 Polyimide, 15% Graphite, 10% PTFE Filled (PI)
Categories:	Polymer; Thermoplastic; Polyimide, Thermoplastic; Thermoplastic Polyimide, Graphite Filled; Thermoplastic Polyimide, Molded, PTFE Filled
Material Notes:	TECASINT™ 2000 series of polyimide stock shapes provide a superior combination of high temperature and bearing and wear, properties that make it an ideal choice for the most demanding applications. TECASINT™ 2011 is very pure, and exhibits low outgassing. It is also characterized by it’s long term thermal stability, outstanding wear resistance, high creep resistance, and strength up to its continuous use temperature of 536° F. TECASINT™ 2021 contains 15% graphite and is also available for applications requiring improved wear resistance & lower coefficient of friction. Superior high temperature characteristics (TECASINT™ 2000 series can operate up to 536° F continuously) Excellent long-term thermal stability Outstanding bearing and wear properties (at elevated temperatures, TECASINT™ 2000 formulations offer superior wear rates) Excellent creep resistance High strength and stiffness properties High purity characteristics (only extremely low levels of extractables and ionic impurities are apparent in TECASINT™ 2011) Good chemical resistance (TECASINT™ 2000 series is not attacked by common solvents or fuels and is acceptable for use in contact with many acids) TECASINT™ 2000 series with their superior physical properties, are ideal for applications in the aerospace, nuclear, automotive, electrical/electronics, and chemical processing industries. TECASINT™ shapes are excellent candidates for high purity applications in the semiconductor processing industry. Typical components produced from TECASINT™ applications include seals, thrust washers, bushings and wear pads in transportation/off-highway equipment, insulating and support elements in electrical welding and brazing equipment, and wafer-handling components in the harsh environment of semiconductor plasma ovens. Pump and valve seals, vanes, and piston rings are also commonly produced from TECASINT™ series materials. Information Provided by Ensinger Inc.
Vendors:

Available Properties

Density, DIN 53 479
Filler Content, PTFE
Filler Content, Graphite
Water Absorption, EN ISO 62
Water Absorption, EN ISO 62
Hardness, Shore D, DIN 53 505
Tensile Strength, Yield, EN ISO 527
Elongation at Break, EN ISO 527
Tensile Modulus, EN ISO 527
Flexural Strength, EN ISO 178
Flexural Modulus, EN ISO 178
Flexural Strain at Yield, EN ISO 178
Compressive Yield Strength, EN ISO 604, 10% Strain
Compressive Strength, EN ISO 604
Compressive Modulus, EN ISO 604
Charpy Impact Unnotched, EN ISO 179
Charpy Impact, Notched, EN ISO 179
Compression Set, EN ISO 604, Compression at Break
Maximum Service Temperature, Air
Glass Transition Temp, Tg, DMTA
Flammability, UL94

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

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