Resinlab® EP1112 Clear Electronic Grade Epoxy Encapsulant

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Resinlab® EP1112 Clear Electronic Grade Epoxy Encapsulant
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	Resinlab™ EP 1112 Clear is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. Its low viscosity allows for good wicking and penetration into components and circuitry and also gives good air release. It has very good resistance to water, acids and bases and most organic solvents. Thermal shock and cycling properties are also enhanced by its high elongation giving it the ability to absorb difference in CTE's of substrates. It was especially formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP 1112 Clear will reach full cure at room temperature within 6 to 12 hours. Cure time can be accelerated by the application of heat after product has gelled. Times and temperatures from 1 hour at 65°C to 10 minutes at 100°C are typical for small castings (less than 50 grams). Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.
Vendors:

Available Properties

Specific Gravity, Part B
Specific Gravity, Mixed
Specific Gravity, Part A
Viscosity, Part A
Viscosity, Part B
Viscosity, Mixed
Hardness, Shore D
Tensile Strength, Ultimate
Tensile Strength, Yield
Elongation at Break
Elongation at Yield
Tensile Modulus
Compressive Yield Strength
Compressive Strength
Compressive Modulus
Adhesive Bond Strength, Lap shear; 2024 T3 Al Abraded / MEK Wipe
Volume Resistivity
Dielectric Constant
Dielectric Strength
CTE, linear
Thermal Conductivity
Maximum Service Temperature, Air
Minimum Service Temperature, Air
Glass Transition Temp, Tg
Transmission, Visible, clear; thickness not quantified
Pot Life, Mass: 50g

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

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