| LORD CoolTherm™ MG -133 thermally conductive gel is a one-component, silicone interface material that exhibits the low thermal resistance properties of a grease while possessing the integrity of a gel. CoolTherm MG-133 gel is designed to provide efficient heat transfer from flip chip microprocessors, PPGAs, BGAs, microBGAs, DSP chips, graphic accelerator chips, and other high wattage electronic components that are on ceramic substrates. CoolTherm MG-133 gel was not developed for organic substrates. Features: achieves thin bondlines of 1-2 mils, minimizing the thermal pathway and maximizing heat flow. provides high thermal conductivity for applications where superior heat dissipation is required. provides minimal thermal resistance due to low viscosity and good wetting. provides excellent resistance to moisture and temperature cycling; resists pump-out and cracking. low modulus at elevated temperatures allows material to be repaired. All information provided by Lord. |
