Product Highlights:- Easy mix ratio of 1:1 by weight or volume
- Outstanding dimensional stability
- Superior thermal conductivity
- High lap shear strength (> 2,100 psi)
- Nickel filled, electrically conductive
- 100% solids system
Kohesi Bond KB 1686 MF is a two component, nickel filled epoxy system suitable for bonding, coating and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Firstly, it offers very good electrical conductivity and dimensional stability. This epoxy system rapidly cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1686 MF offers a volume resistivity of 5 - 10 ohm-cm. It is ideal for use in static dissipation and EMI/RFI shielding applications. It offers an extensive service temperature range of -50°C to +120°C. It is an outstanding adhesive that offers superb physical strength properties, allowing it to adhere well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical and thermal conductivity (1.3 - 1.4 W/m/K), it also offers excellent chemical resistance to various cleaning agents, oils and water. Part A and Part B are gray in color. It has a thixotropic paste like consistency and a very low coefficient of thermal expansion (CTE). Owing to its versatile performance, KB 1686 MF is widely used in electronics, aerospace, electrical, semiconductor, microwave and many OEM applications. Typical Applications: Information provided by Kohesi Bond Custom Engineered Adhesives |
