| Appearance: White paste Components: One component - requires no mixing Cure: Heat cure Application: Die attach LOCTITE ABLESTIK QMI536 is a Fluoropolymer filled non-conductive adhesive for attachment of intergated circuits and components to advanced substrates, including PBGAs, CSPs, array packages, and stacked die. This material is hydrophobic and stable at high temperatures. These features produce a void-free bond line with excellent interfacial adhesive strength to a wide variety of organic and metal surfaces, including solder mask, BT, FR, polyimide, and Au. The adhesive also has excellent dielectric properties. LOCTITE ABLESTIK QMI536 can be cured in a conventional oven, on a snap cure oven, or utilize SkipCure™ processing on a die bonder or wire bonder. The material is formulated to produce cure onset below 100°C. This can reduce or eliminate the need to pre-dry organic subsrates prior to the die attach process. Information provided by Loctite® |
