Product Highlights:- Superior thermal conductivity
- Very good flow properties
- Withstands cryogenic shocks and cycling
- Outstanding mechanical strength properties
- Excellent electrical insulation properties
- Capable of passing NASA low outgassing
Kohesi Bond KB 1039 CRLP-AO is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This epoxy system offers excellent adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers. It offers a long working life at room temperature of over 4 - 5 hours and cures quickly at elevated temperatures. The optimal cure schedule is a room temperature set-up followed by a heat cure at 90°C for 3 - 5 hours. KB 1039 CRLP-AO is specially formulated for use in cryogenic applications. It offers excellent resistance to cryogenic shocks and cycles down to 4K. It is thermally conductive and it is capable of passing NASA standards for low outgassing (ASTM E-595). This superior adhesive fosters outstanding physical strength properties. It offers very low shrinkage upon cure and excellent flow properties. In addition to superior electrical insulation, it also offers very good chemical resistance. Part A is black and Part B is off white in color. KB 1039 CRLP-AO is widely used in applications where thermal conductivity, low outgassing and cryogenic serviceability are key requirements. Typical Applications: - Bonding
- Sealing
- Coating
- Potting
- Encapsulation
Information provided by Kohesi Bond Custom Engineered Adhesives |
