Product Benefits:
Application: Die attach
Filler Type: Silver
Substrates: Silver-plated copper leadframes, Palladiumplated copper leadframes and Silver-plated Alloy 42 leadframes
LOCTITE ABLESTIK 8390 die attach adhesive has been formulated for use in high throughput die attach applications. It is suitable for die sizes up to 8 x 8 mm.
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Category NotesPlastic