Metal matrix composite made up principally of beryllium and crystal BeO platelets. Produced by blending the beryllium and beryllium oxide powders into a homogeneous mixture to create isotropic properties. This mix is hot isostatically pressed (HIP'd) into fully dense blocks for further processing into finished blanks and subsequent machining into components. These materials are used in electronic packaging heat sinks for MCM-L, SEM-E, BGA's, and RF/Microwave applications. The CTE can be controlled by varying the BeO content to match with die materials like GaAs or silicon in RF/microwave applications or match AuSn or AuGe over brazing/soldering temperatures, Kovar, Alloy 46 or 48, and other packaging materials. Can be machined by conventional processes. Corrosion resistance similar to aluminum. For protection in severe environments such as salt fog, the composite may be coated in a number of ways such as electroless or electrolytic nickel plating, chrome plating, and gold or silver plating for brazing or soldering operations. Please note that there are health hazards associated with beryllium, especially when present as airborne particles generated during processing. As with any material, be aware of hazards and take steps to reduce exposure to a safe level. Information provided by Brush Wellman. Brush Engineered Materials Inc. changed its name to Materion Corporation in March 2011. |