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Chemically Resistant adhesives
Parker Chomerics THERM-A-GAP™ 974 Thermally Conductive Gap Filler Pad
Categories: Polymer; Thermoset; Silicone

Material Notes: Description: THERM-A-GAP™ 974 gap fillers offer the highest thermal conductivity for low to moderate clamping force applications.

Features/Benefits: High thermal conductivity; 974 and G974 supplied with PSA for ease of use

Typical Applications: Telecommunications equipment; Consumer electronics; Automotive electronics (ECUs); LEDs, lighting; Power conversion and Power semiconductors

Product Attributes: Excellent thermal performance and Acrylic PSA for improved application

Information provided by Chomerics

Vendors:
Available Properties
  • Specific Gravity, ASTM D792
  • Thickness
  • Deformation, ASTM C165 MOD, 0.025 in/min rate
  • Deformation, ASTM C165 MOD, 0.025 in/min rate
  • Deformation, ASTM C165 MOD, 0.025 in/min rate
  • Deformation, ASTM C165 MOD, 0.025 in/min rate
  • Outgassing - Total Mass Loss, ASTM E595, TML
  • Collected Volatile Condensable Material, ASTM E595
  • Hardness, Shore A, ASTM D2240
  • Volume Resistivity, ASTM D257
  • Dielectric Constant, ASTM D150
  • Dielectric Strength, ASTM D149
  • Dissipation Factor, Chomerics Test
  • CTE, linear, ASTM E831
  • Specific Heat Capacity, ASTM D1269
  • Thermal Conductivity, ASTM D5470
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Shelf Life, Chomerics, Months from date of shipment
  
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Manufacturer Notes:
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Category Notes
Plastic

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Chemically Resistant adhesives
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