| LORD Thermoset 781 epoxy adhesive is a two-component, thixotropic adhesive system designed to temporarily bond silicon ingots to a holding fixture for the purpose of wafer slicing. The ingot should be pre-coated with a primer prior to adhesive application to allow for easy release of the sliced wafers from the fixture. Features: provides excellent adhesion to a wide variety of surfaces. remains in position when applied on vertical or overhead surfaces, allowing for greater process flexibility. develops high bond strength in 12-16 hours at room temperature. All information provided by Lord. |
