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Master Bond adhesives
Henkel Loctite® ECCOBOND 50400-1 Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Black

Cure: Heat Cure

Product Benefits:

  • One component
  • Low viscosity
  • Low CTE
Application: Encapsulant - glob top

LOCTITE ECCOBOND 50400-1 glob top is designed for encapsulating wire bonded bare die on epoxy laminate and similar substates. The formulation of this single component material ensures a long pot and a very stable viscosity during use. It is recommended for use on ICs with high wire profiles and in applications where the spreading of the glob top during cure must be controlled.

Information provided by Loctite®

Vendors:
Available Properties
  • Density
  • Solids Content
  • Filler Content
  • Moisture Absorption, Cured
  • Brookfield Viscosity, Uncured, Sp #6, Speed 20 rpm
  • Brookfield Viscosity, Uncured, Sp #6, Speed 2.5 rpm
  • Hardness, Shore D, Cured
  • Volume Resistivity
  • Dielectric Constant
  • Dissipation Factor
  • CTE, linear, Cured
  • Thermal Conductivity, Cured
  • Glass Transition Temp, Tg, Cured
  • Shrinkage, With Pre-cure of1hour @ 120°C
  • Shrinkage, On Cure
  • Cure Time, + 1 hour @ 150°C, Low Stress Cure Schedule
  • Cure Time
  • Pot Life
  • Pot Life
  • Shelf Life, from date of manufacture
  
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Manufacturer Notes:
Loctite Division of Henkel

Category Notes
Plastic

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